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DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]
DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2] is backordered and will ship as soon as it is back in stock.
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Care information
Care information
Please follow the manufacturer’s care recommendations as provided in the product manual.
Delivery and Shipping
Delivery and Shipping
All orders placed by 4pm EST will ship the same day as long as everything requested is currently in stock.
Shipping would be either via UPS, Canada Post or USPS.
All orders outside the United States may incur Custom charges of your country.
Polishing Compound - Fine Cut - 32oz
This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.
Features:
- Effectively removes holograms
- Free of solvents and silicone
- Appearance: Cream/Paste
- Solubility: N/A
- pH: 8
Use & Application:
For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.
Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.
Specifications:
- Type: Restoration & Compounds
- Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
- UPC: 850019168440
Brochure (pdf)
DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]
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